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SLIP
2005
ACM
13 years 11 months ago
2005
ACM
The interconnection architecture of FPGAs such as switches dominates performance of FPGAs. Three-dimensional integration of FPGAs overcomes interconnect limitations by allowing in...
GLVLSI
2009
IEEE
14 years 2 days ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
DAC
2007
ACM
14 years 6 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
3DIC
2009
IEEE
14 years 5 days ago
2009
IEEE
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
ASPLOS
2006
ACM
13 years 11 months ago
2006
ACM
While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...