6 search results - page 1 / 2 » Reticle Floorplanning and Wafer Dicing for Multiple Project ... |
ISQED
2005
IEEE
13 years 10 months ago
2005
IEEE
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
—As the VLSI manufacturing technology advances into the deep sub-micron(DSM) era, the mask cost can reach one or two million dollars. Multiple project wafers (MPW) which put diï¬...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
- Chip floorplan in a reticle for Multi-Project Wafer (MPW) plays a key role in deciding chip fabrication cost. In this paper1 , we propose a methodology to explore reticle floopla...
ISVLSI
2005
IEEE
13 years 10 months ago
2005
IEEE
This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume pr...
ICCD
2004
IEEE
14 years 1 months ago
2004
IEEE
