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DATE
2007
IEEE
118views Hardware» more  DATE 2007»
13 years 11 months ago
Statistical model order reduction for interconnect circuits considering spatial correlations
In this paper, we propose a novel statistical model order reduction technique, called statistical spectrum model order reduction (SSMOR) method, which considers both intra-die and...
Jeffrey Fan, Ning Mi, Sheldon X.-D. Tan, Yici Cai,...
ICCD
2007
IEEE
322views Hardware» more  ICCD 2007»
14 years 1 months ago
Voltage drop reduction for on-chip power delivery considering leakage current variations
In this paper, we propose a novel on-chip voltage drop reduction technique for on-chip power delivery networks of VLSI systems in the presence of variational leakage current sourc...
Jeffrey Fan, Ning Mi, Sheldon X.-D. Tan
TCAD
2008
115views more  TCAD 2008»
13 years 4 months ago
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
Javid Jaffari, Mohab Anis
DAC
2004
ACM
14 years 5 months ago
Worst-case circuit delay taking into account power supply variations
Current Static Timing Analysis (STA) techniques allow one to verify the timing of a circuit at different process corners which only consider cases where all the supplies are low o...
Dionysios Kouroussis, Rubil Ahmadi, Farid N. Najm
DAC
2005
ACM
14 years 5 months ago
Full-chip analysis of leakage power under process variations, including spatial correlations
In this paper, we present a method for analyzing the leakage current, and hence the leakage power, of a circuit under process parameter variations that can include spatial correla...
Hongliang Chang, Sachin S. Sapatnekar