4 search results - page 1 / 1 » Switching constraint-driven thermal and reliability analysis... |
ISQED
2011
IEEE
12 years 8 months ago
2011
IEEE
As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability targets. For microprocessors...
DAC
2006
ACM
13 years 10 months ago
2006
ACM
Negative bias temperature instability (NBTI) has become the dominant reliability concern for nanoscale PMOS transistors. In this paper, a predictive model is developed for the deg...
DAC
2006
ACM
14 years 5 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
A stable, multiple energy domain and multi scale simulation tool for Microsystems is developed. A structured design methodology is adopted for design and optimization of RF MEMS sh...