18 search results - page 1 / 4 » TSIC: Thermal Scheduling Simulator for Chip Multiprocessors |
PCI
2005
Springer
13 years 10 months ago
2005
Springer
Abstract. Increased power density, hot-spots, and temperature gradients are severe limiting factors for today’s state-of-the-art microprocessors. However, the flexibility offer...
TCAD
2008
13 years 4 months ago
2008
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
DATE
2009
IEEE
13 years 11 months ago
2009
IEEE
—Dynamic Thermal Management techniques have been widely accepted as a thermal solution for their low cost and simplicity. The techniques have been used to manage the heat dissipa...
CODES
2007
IEEE
13 years 11 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
ISQED
2010
IEEE
13 years 10 months ago
2010
IEEE
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...