4 search results - page 1 / 1 » Temperature-aware MPSoC scheduling for reducing hot spots an... |
TVLSI
2008
13 years 4 months ago
2008
Thermal hot spots and high temperature gradients degrade reliability and performance, and increase cooling costs and leakage power. In this paper, we explore the benefits of temper...
ASPDAC
2008
ACM
13 years 6 months ago
2008
ACM
Thermal hot spots and temperature gradients on the die need to be minimized to manufacture reliable systems while meeting energy and performance constraints. In this work, we solve...
DATE
2007
IEEE
13 years 11 months ago
2007
IEEE
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, timing, performance, cooling costs and leakage power. Conventional thermal managem...
ASPDAC
2010
ACM
13 years 2 months ago
2010
ACM
Heterogeneous multiprocessor system-on-chips (MPSoCs) which consist of cores with various power and performance characteristics can customize their configuration to achieve higher ...