21 search results - page 4 / 5 » Thermal via planning for 3-D ICs |
ASPDAC
2012
ACM
12 years 1 months ago
2012
ACM
— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
ASPDAC
2005
ACM
13 years 11 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...
ICCD
2007
IEEE
14 years 2 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...