—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
— In this paper, we present the first work on the Steiner routing for 3D stacked ICs. In the 3D Steiner routing problem, the pins are located in multiple device layers, which ma...
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
Chung-Kuan Cheng, Peng Du, Andrew B. Kahng, Shih-H...