5 search results - page 1 / 1 » Use of Sensitivities and Generalized Substrate Models in Mix... |
DAC
1996
ACM
13 years 8 months ago
1996
ACM
A novel methodology for circuit design and automatic layout generation is proposed for a class of mixed-signal circuits in presence of layout parasitics and substrate induced nois...
ISQED
2003
IEEE
13 years 9 months ago
2003
IEEE
A simple, efficient CAD-oriented equivalent circuit modeling approach of frequency-dependent behavior of substrate noise coupling is presented. It is shown that the substrate exhi...
ISLPED
2006
ACM
13 years 10 months ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
ISPD
2003
ACM
13 years 9 months ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
DATE
2010
IEEE
13 years 9 months ago
2010
IEEE
—Variations of process parameters have an important impact on reliability and yield in deep sub micron IC technologies. One methodology to estimate the influence of these effects...