4 search results - page 1 / 1 » Wire congestion and thermal aware 3D global placement |
ASPDAC
2005
ACM
13 years 11 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
ASPDAC
2006
ACM
13 years 11 months ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
ICCAD
2007
IEEE
14 years 2 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
ICCAD
2004
IEEE
14 years 2 months ago
2004
IEEE
Crosstalk noise has become an important issue as technology scales down for timing and signal integrity closure. Existing works to fix crosstalk noise are mostly done at the rout...