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DAC
2012
ACM
9 years 9 months ago
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
Xin Zhao, Michael Scheuermann, Sung Kyu Lim
DAC
2011
ACM
10 years 6 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
DAC
2011
ACM
10 years 6 months ago
AENEID: a generic lithography-friendly detailed router based on post-RET data learning and hotspot detection
In the era of deep sub-wavelength lithography for nanometer VLSI designs, manufacturability and yield issues are critical and need to be addressed during the key physical design i...
Duo Ding, Jhih-Rong Gao, Kun Yuan, David Z. Pan
books