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DAC
2012
ACM
7 years 12 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
DAC
2011
ACM
8 years 9 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an ef´Čücient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
ECCV
2002
Springer
10 years 11 months ago
Statistical Modeling of Texture Sketch
Recent results on sparse coding and independent component analysis suggest that human vision first represents a visual image by a linear superposition of a relatively small number ...
Ying Nian Wu, Song Chun Zhu, Cheng-en Guo
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