TCAD
2008
13 years 4 months ago
2008
Due to the increasing abstraction gap between the initial system model and a final implementation, the verification of the respective models against each other is a formidable task...
TCAD
2008
13 years 4 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
TCAD
2008
13 years 4 months ago
2008
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
TCAD
2008
13 years 4 months ago
2008
Abstract--The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer-circuit design. High voltages that resulted from ESD might cause high cu...
TCAD
2008
13 years 4 months ago
2008
Abstract--A key design constraint of circuits used in handheld devices is the power consumption, mainly due to battery life limitations. Adaptive power management (APM) techniques ...
TCAD
2008
13 years 4 months ago
2008
Abstract--Advances in very large-scale integration technology make clock skew more susceptible to process variations. Notwithstanding efficient exact zero-skew algorithms, clock sk...
TCAD
2008
13 years 4 months ago
2008
We propose a methodology for the early estimation of communication implementation choices eftarting from an abstract transaction level system model (TLM). The reference version of ...
TCAD
2008
13 years 4 months ago
2008
Safety-critical feedback-control applications may suffer faults in the controlled plant as well as in the execution platform, i.e., the controller. Control theorists design the con...
TCAD
2008
13 years 4 months ago
2008
The verification of a system-on-chip is challenging due to its high level of integration. Multiple components in a system can behave concurrently and compete for resources. Hence, ...
TCAD
2008
13 years 4 months ago
2008
An efficient method based on a direct boundary element method is proposed for extracting frequency-dependent substrate coupling parameters. A frequency-independent real-valued line...