CLEIEJ   2010
Wall of Fame | Most Viewed CLEIEJ-2010 Paper
13 years 4 months ago
3D-Via Driven Partitioning for 3D VLSI Integrated Circuits
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
Sandro Sawicki, Gustavo Wilke, Marcelo O. Johann, ...
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