208
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—In both pre-silicon and post-silicon validation, the detection of design errors requires both stimulus capable of activating the errors and checkers capable of detecting the beh...
172
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
— In this paper, we present an obstacle-aware clock tree synthesis method for through-silicon-via (TSV)-based 3D ICs. A unique aspect of this problem lies in the fact that variou...
187
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Di...
157
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
180
click to vote
ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—Host-compiled simulation has been widely adopted as a practical approach for fast and high-level evaluation of complex software-intensive systems at early stages of the design p...