210
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DAC
2009
ACM
16 years 8 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
158
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DAC
2009
ACM
16 years 8 months ago
2009
ACM
With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the ther...
286
click to vote
DAC
2009
ACM
16 years 8 months ago
2009
ACM
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
172
click to vote
DAC
2009
ACM
16 years 8 months ago
2009
ACM
This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of therma...
151
click to vote
DAC
2009
ACM
16 years 8 months ago
2009
ACM
In this study, we apply a novel synthesis technique for implementing robust digital computation in nanoscale lattices with random interconnects: percolation theory on random graph...