Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading

Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delamination reliability problem. In this study, multifunctional micro-moire

• Type: Journal
• Year: 2006
• Where: MR
• Authors: Y. L. Zhang, D. X. Q. Shi, W. Zhou
• Keywords: CTE Mismatch, Flip Chip Assembly, Interfacial Fracture, MR 2006, Robotics