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Modeling of board-level package by Finite Element Analysis and laser interferometer measurements

15 years 1 months ago

Modeling of board-level package by Finite Element Analysis and laser interferometer measurements

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Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao

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Added	29 Jan 2011
Updated	29 Jan 2011
Type	Journal
Year	2010
Where	MR
Authors	Bo Zhang, PinKuan Liu, Han Ding, Wenwu Cao

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