Parameterized transient thermal behavioral modeling for chip multiprocessors

In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for high-performance chip-multiprocessor (CMP) design. We propose a new approach, called ParThermPOF, to build the parameterized thermal performance models from the given architecture thermal and power information. The new method can include a number of parameters such as the locations of thermal sensors in a heat sink, different components (heat sink, heat spread, core, cache, etc.), thermal conductivity of heat sink materials, etc. The method consists of two steps: first, response surface method based on low-order polynomials is applied to build the parameterized models at each time point for all the given sampling nodes in the parameter space. Second, an improved generalized pencil-of-function (GPOF) method is employed to build the transfer-function based behavioral models for each time-varying coefficient o...

• Type: Conference
• Year: 2008
• Where: ICCAD
• Authors: Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Murli Tirumala
• Keywords: Hardware, ICCAD 2008, Parameterized Thermal Model, Parameterized Thermal Performance, Thermal Behavioral Modeling