34 search results - page 5 / 7 » 3D floorplanning with thermal vias |
ICCAD
2005
IEEE
15 years 6 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
MICRO
2006
IEEE
15 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ASPDAC
2005
ACM
15 years 3 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
3DIC
2009
IEEE
15 years 2 months ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...