Sciweavers

1756 search results - page 76 / 352
» A 3-D Self-Reconfigurable Structure
Sort
View
90
Voted
ICIP
2006
IEEE
15 years 12 months ago
Resolution Improvement from Stereo Images with 3D Pose Differences
Resolution improvement from several images is typically restricted to simple planar rotations and translations. In this paper, a super-resolution algorithm that allows 3D ego-moti...
Siu-Hang Or, Ying Kin Yu, Kin-hong Wong, Michael M...
73
Voted
ICCAD
2006
IEEE
137views Hardware» more  ICCAD 2006»
15 years 7 months ago
Yield prediction for 3D capacitive interconnections
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
Alberto Fazzi, L. Magagni, Mario de Dominicis, Pao...
ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
15 years 7 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
71
Voted
ISBI
2009
IEEE
15 years 5 months ago
Segmentation of Inflamed Synovia in Multi-Modal 3D MRI
We address the difficult problem of segmenting the inflamed synovial tissue in multi-modal 3D MR sequences of the wrist. The complex morphology of the structures to segment, the...
Curzio Basso, Matteo Santoro, Alessandro Verri, Ma...
101
Voted
CRV
2009
IEEE
225views Robotics» more  CRV 2009»
15 years 5 months ago
3D Modeling from Multiple Views with Integrated Registration and Data Fusion
This paper presents an integrated modeling system capable of generating coloured three dimensional representations of a scene observed from multiple viewpoints. Emphasis is given ...
Alain Boyer, Phillip Curtis, Pierre Payeur