Resolution improvement from several images is typically restricted to simple planar rotations and translations. In this paper, a super-resolution algorithm that allows 3D ego-moti...
Siu-Hang Or, Ying Kin Yu, Kin-hong Wong, Michael M...
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
Alberto Fazzi, L. Magagni, Mario de Dominicis, Pao...
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
We address the difficult problem of segmenting the inflamed synovial tissue in multi-modal 3D MR sequences of the wrist. The complex morphology of the structures to segment, the...
This paper presents an integrated modeling system capable of generating coloured three dimensional representations of a scene observed from multiple viewpoints. Emphasis is given ...