26 search results - page 3 / 6 » A Layout Approach for Electrical and Physical Design Integra... |
ICCAD
2010
IEEE
13 years 4 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
IJRR
2007
13 years 6 months ago
2007
— Haptics, like the fields of robotics and motion control, relies on high stiffness position control of electric motors. Traditionally DC motors are driven by current amplifier...
ICCAD
1991
IEEE
13 years 9 months ago
1991
IEEE
As feature sizes decrease and chip sizes increase, the area and performance of chips become dominated by the interconnect. In spite of this trend, most existing synthesis systems ...
ICCAD
2003
IEEE
14 years 3 months ago
2003
IEEE
Ultra-deep submicron manufacturability impacts physical design (PD) through complex layout rules and large guardbands for process variability; this creates new requirements for ne...
DAC
2003
ACM
14 years 7 months ago
2003
ACM
Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best pow...