3312 search results - page 22 / 663 » A Systemic Plan of Technology Integration |
SLIP
2009
ACM
15 years 4 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
ASPDAC
2007
ACM
15 years 1 months ago
2007
ACM
The scaling of CMOS technology into the nanometer era enables the fabrication of highly integrated systems, which increasingly contain analog and/or RF parts. However, scaling into...
ASPDAC
2004
ACM
15 years 2 months ago
2004
ACM
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance and signal integrity. Buffer insertion is one...
CONTEXT
2007
Springer
15 years 3 months ago
2007
Springer
In this paper we present an educational tool which has been designed to manage (learning) knowledge acquired from the interactions with the students, and to automatically aids educ...
EPIA
1997
Springer
15 years 1 months ago
1997
Springer
dimension of abstraction and specificity, and they may mix both top-level goals and subgoals when describing what they want a plan to do. We show how the Prodigy planning system h...