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DAC
2011
ACM
13 years 9 months ago
2011
ACM
Variations in delay caused by within-die and die-to-die process variations and SOI history effect increase timing margins and reduce performance. In order to develop mitigation te...
DAC
2012
ACM
13 years 6 days ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
VLSID
2007
IEEE
15 years 10 months ago
2007
IEEE
Recent advances in microfluidics technology have led to the emergence of miniaturized biochip devices for biochemical analysis. A promising category of microfluidic biochips relie...
BIOSIG
2003
14 years 11 months ago
2003
: In this paper we propose a multifactor biometric sketch authentication method based on biometric sketch recognition and a user’s personal knowledge about the sketch‘s content...
MCS
2008
Springer
14 years 9 months ago
2008
Springer
In this paper we propose a numerical method for approximating the product of a matrix function with multiple vectors by Krylov subspace methods combined with a QR decomposition of...