380 search results - page 9 / 76 » Accurate Predictive Interconnect Modeling for System-Level D... |
ASPDAC
2007
ACM
15 years 3 months ago
2007
ACM
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
111
Voted
SLIP
2009
ACM
15 years 6 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
106
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ICCAD
2005
IEEE
15 years 8 months ago
2005
IEEE
A priori wirelength estimation is concerned with predicting various wirelength characteristics before placement. In this work we propose a novel, accurate estimator of net lengths...
90
Voted
DATE
2009
IEEE
15 years 6 months ago
2009
IEEE
As industry moves towards many-core chips, networks-on-chip (NoCs) are emerging as the scalable fabric for interconnecting the cores. With power now the first-order design constr...
81
Voted
ISLPED
2009
ACM
15 years 6 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...