—CMOS scaling has long been a source of dramatic performance gains. However, semiconductor feature size reduction has resulted in increasing levels of operating temperatures and ...
Shantanu Gupta, Shuguang Feng, Amin Ansari, Scott ...
—Aggressive technology scaling to 45nm and below introduces serious reliability challenges to the design of microprocessors. Since a large fraction of chip area is devoted to on-...
Amin Ansari, Shantanu Gupta, Shuguang Feng, Scott ...
—During any composite computation, there is a constant need for rounding intermediate results before they can participate in further processing. Recently, a class of number repre...
Peter Kornerup, Jean-Michel Muller, Adrien Panhale...
—This paper considers the problem of dividing a two-word integer by a single-word integer, together with a few extensions and applications. Due to lack of efficient division ins...
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...