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DAC
2011
ACM
14 years 2 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi

Book
352views
17 years 1 months ago
Object-Oriented Reengineering Patterns
"The documentation is missing or obsolete, and the original developers have departed. Your team has limited understanding of the system, and unit tests are missing for many, i...
Serge Demeyer, Stéphane Ducasse, Oscar Nierstrasz
DAC
2007
ACM
16 years 4 months ago
Trusted Hardware: Can It Be Trustworthy?
Processing and storage of confidential or critical information is an every day occurrence in computing systems. The trustworthiness of computing devices has become an important co...
Cynthia E. Irvine, Karl N. Levitt
WWW
2005
ACM
16 years 3 months ago
A service creation environment based on end to end composition of Web services
The demand for quickly delivering new applications is increasingly becoming a business imperative today. Application development is often done in an ad hoc manner, without standar...
Vikas Agarwal, Koustuv Dasgupta, Neeran M. Karnik,...
WWW
2005
ACM
16 years 3 months ago
An environment for collaborative content acquisition and editing by coordinated ubiquitous devices
Digital content is not only stored by servers on the Internet, but also on various embedded devices belonging to ubiquitous networks. In this paper, we propose a content processin...
Yutaka Kidawara, Tomoyuki Uchiyama, Katsumi Tanaka
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