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112
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ICCAD
2008
IEEE
16 years 12 days ago
2008
IEEE
In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
136
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ICCAD
2006
IEEE
16 years 12 days ago
2006
IEEE
Soft-core microprocessors mapped onto field-programmable gate arrays (FPGAs) represent an increasingly common embedded software implementation option. Modern FPGA soft-cores are p...
134
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ICCAD
2006
IEEE
16 years 12 days ago
2006
IEEE
In order to handle device matching in analog circuits, some pairs of modules are required to be placed symmetrically. This paper addresses this device-level placement problem for ...
114
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ICCAD
2006
IEEE
16 years 12 days ago
2006
IEEE
High power consumption will shorten battery life for handheld devices and cause thermal and reliability problems. One way to lower the dynamic power consumption is to reduce the s...
134
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ICCAD
2001
IEEE
16 years 11 days ago
2001
IEEE
The use of nanometer technologies is making it increasingly important to consider transient characteristics of a circuit’s power dissipation (e.g., peak power, and power gradien...