681 search results - page 17 / 137 » An Assembly Process Model for Method Engineering |
IPPS
2007
IEEE
15 years 4 months ago
2007
IEEE
This workshop provides a forum for an overview, project presentations, and discussion of the research fostered and funded initially by the NSF Next Generation Software (NGS) Progr...
MR
2002
14 years 9 months ago
2002
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
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BCB
2010
14 years 4 months ago
2010
Growing sequencing and assembly efforts have been met by the advances in high throughput machines. However, the presence of massive amounts of repeats and transposons complicates ...
ICSE
1998
IEEE-ACM
15 years 1 months ago
1998
IEEE-ACM
other projects in the database. Software development data is highly variable, which often result,s in underlying trends being hidden. In order to address this problem, a method of ...
DESRIST
2009
Springer
15 years 2 months ago
2009
Springer
Despite the widespread recognition that information technology (IT) and business process are tightly connected, existing system design methods provide limited guidance on how to t...