The HW/SW partitioning problem addressed in this paper is one of the key steps in the co-design flow of heterogeneous embedded systems. Generally the aim is to provide solutions t...
Luc Bianco, Michel Auguin, Guy Gogniat, Alain Pega...
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Power delivery, electricity consumption, and heat management are becoming key challenges in data center environments. Several past solutions have individually evaluated different ...
Abstract— This paper addresses the module assignment problem in pinlimited designs under the stacked-Vdd circuit paradigm. A partition-based algorithm is presented for efficient...
The design of high-throughput large-state Viterbi decoders relies on the use of multiple arithmetic units. The global communication channels among these parallel processors often ...