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» Analyzing Packaging Trade-Offs During System Design
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115
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JSW
2007
112views more  JSW 2007»
15 years 1 months ago
A Framework for Design Engineering Education with Workflow-based e-Learning System
—Education of design engineering has started to change in response to the advancement of computer technology. This paper proposes a new design engineering educational framework u...
Kazuo Hiekata, Hiroyuki Yamato, Piroon Rojanakamol...
ACSD
2007
IEEE
81views Hardware» more  ACSD 2007»
15 years 8 months ago
A model-driven design approach for mechatronic systems
The software design is one of the most challenging tasks during the design of a mechatronic system. On one hand, it has to provide solutions to deal with concurrency and timelines...
Jinfeng Huang, Jeroen Voeten, Marcel A. Groothuis,...
96
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SLIP
2009
ACM
15 years 8 months ago
From 3D circuit technologies and data structures to interconnect prediction
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
Robert Fischbach, Jens Lienig, Tilo Meister
ITC
2003
IEEE
110views Hardware» more  ITC 2003»
15 years 7 months ago
An extension to JTAG for at-speed debug on a system
When developing new designs, debugging the prototype is important to resolve application malfunction. During this board design debug, often a few pins of an IC are measured to che...
Leon van de Logt, Frank van der Heyden, Tom Waayer...
113
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GLVLSI
2006
IEEE
112views VLSI» more  GLVLSI 2006»
15 years 8 months ago
A simulation methodology for reliability analysis in multi-core SoCs
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...
Ayse Kivilcim Coskun, Tajana Simunic Rosing, Yusuf...