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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
15 years 2 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
SIGSOFT
2010
ACM
15 years 2 months ago
Embracing ambiguity
Software helps people fulfill their goals, but development tools lack understanding of those goals. But if development tools did understand how software artifacts relate to higher...
Kenneth C. Arnold, Henry Lieberman
WISE
2010
Springer
15 years 2 months ago
On Identifying and Reducing Irrelevant Information in Service Composition and Execution
The increasing availability of massive information on the Web causes the need for information aggregation by filtering and ranking according to user's goals. In the last years...
Hong Linh Truong, Marco Comerio, Andrea Maurino, S...
HICSS
2011
IEEE
247views Biometrics» more  HICSS 2011»
14 years 8 months ago
Model-Driven Development Meets Security: An Evaluation of Current Approaches
Although our society is critically dependent on software systems, these systems are mainly secured by protection mechanisms during operation instead of considering security issues...
Kresimir Kasal, Johannes Heurix, Thomas Neubauer
ICDAR
2011
IEEE
14 years 4 months ago
CROHME2011: Competition on Recognition of Online Handwritten Mathematical Expressions
— A competition on recognition of online handwritten mathematical expressions is organized. Recognition of mathematical expressions has been an attractive problem for the pattern...
Harold Mouchère, Christian Viard-Gaudin, Da...