61 search results - page 3 / 13 » Attractor-repeller approach for global placement |
ICCAD
2006
IEEE
14 years 3 months ago
2006
IEEE
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
ASPDAC
2005
ACM
13 years 11 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
DATE
2000
IEEE
13 years 10 months ago
2000
IEEE
Novel methodology and algorithms to seamlessly integrate logic synthesis and physical placement through a transformational approach are presented. Contrary to most placement algor...
DAC
2004
ACM
14 years 7 months ago
2004
ACM
The advent of strong multi-level partitioners has made topdown min-cut placers a favored choice for modern placer implementations. We examine terminal propagation, an important st...
DAC
2007
ACM
14 years 7 months ago
2007
ACM
Abstract-- In nanometer-scale VLSI technologies, several interconnect issues like routing congestion and interconnect delay have become the main concerns in placement. However, all...