Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Novel methodology and algorithms to seamlessly integrate logic synthesis and physical placement through a transformational approach are presented. Contrary to most placement algor...
Wilm E. Donath, Prabhakar Kudva, Leon Stok, Paul V...
The advent of strong multi-level partitioners has made topdown min-cut placers a favored choice for modern placer implementations. We examine terminal propagation, an important st...
Abstract-- In nanometer-scale VLSI technologies, several interconnect issues like routing congestion and interconnect delay have become the main concerns in placement. However, all...