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DAC
2011
ACM
13 years 9 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
SIGITE
2004
ACM
15 years 3 months ago
Keeping family of computing related disciplines together
There are efforts underway to define each of several flavors of computing disciplines, including computer science, computer engineering, information science, information technolog...
Reza Kamali, Lillian N. Cassel, Richard J. LeBlanc
ALMOB
2006
113views more  ALMOB 2006»
14 years 9 months ago
Inverse bifurcation analysis: application to simple gene systems
Background: Bifurcation analysis has proven to be a powerful method for understanding the qualitative behavior of gene regulatory networks. In addition to the more traditional for...
James Lu, Heinz W. Engl, Peter Schuster
POPL
2009
ACM
15 years 10 months ago
Modular code generation from synchronous block diagrams: modularity vs. code size
We study modular, automatic code generation from hierarchical block diagrams with synchronous semantics. Such diagrams are the fundamental model behind widespread tools in the emb...
Roberto Lublinerman, Christian Szegedy, Stavros Tr...
CHI
2008
ACM
15 years 10 months ago
Improving the performance of motor-impaired users with automatically-generated, ability-based interfaces
We evaluate two systems for automatically generating personalized interfaces adapted to the individual motor capabilities of users with motor impairments. The first system, SUPPLE...
Krzysztof Z. Gajos, Jacob O. Wobbrock, Daniel S. W...