852 search results - page 41 / 171 » Categories, Allegories and Circuit Design |
ICCAD
2003
IEEE
15 years 8 months ago
2003
IEEE
Placement is one of the most important steps in the RTLto-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and syste...
DAC
2004
ACM
16 years 23 days ago
2004
ACM
Circuits using nano-meter technologies are becoming increasingly vulnerable to signal interference from multiple noise sources as well as radiation-induced soft errors. One way to...
DAC
2012
ACM
13 years 2 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
102
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ISPD
2009
ACM
15 years 6 months ago
2009
ACM
Several approaches to post-silicon adaptation require feedback from a replica of the nominal critical path, whose variations are intended to reflect those of the entire circuit a...
174
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ISPD
2011
ACM
14 years 2 months ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...