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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
15 years 5 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
GLVLSI
2006
IEEE
165views VLSI» more  GLVLSI 2006»
15 years 6 months ago
Block alignment in 3D floorplan using layered TCG
In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as te...
Jill H. Y. Law, Evangeline F. Y. Young, Royce L. S...
SLIP
2004
ACM
15 years 5 months ago
Interconnect-power dissipation in a microprocessor
Interconnect power is dynamic power dissipation due to switching of interconnection capacitances. This paper describes the characterization of interconnect power in a state-of-the...
Nir Magen, Avinoam Kolodny, Uri C. Weiser, Nachum ...
FPGA
2004
ACM
120views FPGA» more  FPGA 2004»
15 years 5 months ago
Flexibility measurement of domain-specific reconfigurable hardware
Traditional metrics used to compare hardware designs include area, performance, and power. However, these metrics do not form a complete evaluation of reconfigurable hardware. For...
Katherine Compton, Scott Hauck
DAC
2003
ACM
16 years 25 days ago
Random walks in a supply network
This paper presents a power grid analyzer based on a random walk technique. A linear-time algorithm is first demonstrated for DC analysis, and is then extended to perform transien...
Haifeng Qian, Sani R. Nassif, Sachin S. Sapatnekar