The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
In this paper, we present a new multi-packing tree (MP-tree) representation for macro placement to handle mixed-size designs. Based on binary trees, the MP-tree is very efficient,...
Thermal/power issues have become increasingly important with more and more transistors being put on a single chip. Many dynamic thermal/power management techniques have been propo...
Asynchronous systems are being viewed as an increasingly viable alternative to purely synchronous systems. This paper gives an overview of the current state of the art in practica...
This paper presents a statistical framework to cooperatively design and develop technology, product circuit, benchmarking and model early in the development stage. The statistical...
Choongyeun Cho, Daeik D. Kim, Jonghae Kim, Jean-Ol...