3002 search results - page 534 / 601 » Cloud Based Design Optimization |
152
Voted
CLEIEJ
2010
15 years 1 months ago
2010
A 3D circuit is the stacking of regular 2D circuits. The advances on the fabrication and packaging technologies allowed interconnecting stacked 2D circuits by using 3D vias. Howeve...
139
Voted
TCOM
2011
14 years 10 months ago
2011
—Low-density parity-check (LDPC) codes are gaining interest for high data rate applications in both terrestrial and spatial communications. They can be designed and studied throu...
130
Voted
IACR
2011
14 years 3 months ago
2011
Although anonymous authentication has been extensively studied, so far no scheme has been widely adopted in practice. A particular issue with fully anonymous authentication schemes...
196
Voted
CVPR
2012
IEEE
13 years 6 months ago
2012
IEEE
In this paper we examine the effect of receptive field designs on classification accuracy in the commonly adopted pipeline of image classification. While existing algorithms us...
176
Voted
HPDC
2012
IEEE
13 years 6 months ago
2012
IEEE
Applications often involve iterative execution of identical or slowly evolving calculations. Such applications require incremental rebalancing to improve load balance across itera...