3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
— Bit interleaved coded multiple beamforming (BICMB) was previously designed to achieve full spatial multiplexing of min(N, M) and full spatial diversity of NM for N transmit and...
There is a continuous research effort devoted to overcome the memory wall problem. Prefetching is one of the most frequently used techniques. A prefetch mechanism anticipates the ...
Plenty of work was contributed in the field of protocol design and performance evaluation of multi-hop networks. It is generally accepted that mobility has a huge impact on the p...
Frank H. P. Fitzek, Leonardo Badia, Michele Zorzi,...
There is an upsurging interest in designing succinct data structures for basic searching problems (see [23] and references therein). The motivation has to be found in the exponent...