It is unknown how to include stochastic process variation into fast-multipole-method (FMM) for a full chip capacitance extraction. This paper presents a parallel FMM extraction us...
In this work, we present a new optical routing framework, O-Router for future low-power on-chip optical interconnect integration utilizing silicon compatible nano-photonic devices...
Duo Ding, Yilin Zhang, Haiyu Huang, Ray T. Chen, D...
Wireless sensor networks (WSNs) have recently gained a great deal of attention as a topic of research, with a wide range of applications being explored. Bulk data dissemination is ...
Wei Dong, Chun Chen, Xue Liu, Jiajun Bu, Yunhao Li...
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
Kwangok Jeong, Andrew B. Kahng, Rasit Onur Topalog...
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...