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DAC
2009
ACM
15 years 4 months ago
PiCAP: a parallel and incremental capacitance extraction considering stochastic process variation
It is unknown how to include stochastic process variation into fast-multipole-method (FMM) for a full chip capacitance extraction. This paper presents a parallel FMM extraction us...
Fang Gong, Hao Yu, Lei He
DAC
2009
ACM
15 years 4 months ago
O-Router: an optical routing framework for low power on-chip silicon nano-photonic integration
In this work, we present a new optical routing framework, O-Router for future low-power on-chip optical interconnect integration utilizing silicon compatible nano-photonic devices...
Duo Ding, Yilin Zhang, Haiyu Huang, Ray T. Chen, D...
DCOSS
2009
Springer
15 years 4 months ago
Performance of Bulk Data Dissemination in Wireless Sensor Networks
Wireless sensor networks (WSNs) have recently gained a great deal of attention as a topic of research, with a wide range of applications being explored. Bulk data dissemination is ...
Wei Dong, Chun Chen, Xue Liu, Jiajun Bu, Yunhao Li...
SLIP
2009
ACM
15 years 4 months ago
Is overlay error more important than interconnect variations in double patterning?
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
Kwangok Jeong, Andrew B. Kahng, Rasit Onur Topalog...
SLIP
2009
ACM
15 years 4 months ago
Integrated interlayer via planning and pin assignment for 3D ICs
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
Xu He, Sheqin Dong, Xianlong Hong, Satoshi Goto