Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
We develop a novel localization theory for planar networks of nodes that measure each other’s relative position, i.e., we assume that nodes do not have the ability to perform me...
Giulia Piova, Iman Shames, Baris Fidan, Francesco ...
Abstract— We relax the monotonicity requirement of Lyapunov’s theorem to enlarge the class of functions that can provide certificates of stability. To this end, we propose two...
The central problem in computational mechanism design is the tension between incentive compatibility and computational ef ciency. We establish the rst significant approximability ...
Christos H. Papadimitriou, Michael Schapira, Yaron...
— Quality of Service (QoS) of disadvantaged networks is usually considered from a purely network standpoint in existing works. Adversarial intervention in such networks is not an...
Vidyaraman Sankaranarayanan, Shambhu J. Upadhyaya,...