497 search results - page 60 / 100 » Design Challenges for High Performance Nano-Technology |
109
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ICCAD
2009
IEEE
14 years 9 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
VLSI
2007
Springer
15 years 6 months ago
2007
Springer
— In the future, high performance computing systems may consist of multiple multicore processors and reconfigurable logic coprocessors. Industry trends indicate that such coproc...
107
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CCGRID
2005
IEEE
15 years 5 months ago
2005
IEEE
Large grid installations require global access to massive data stores. Parallel file systems give high throughput within a LAN, but cross-site data transfers lack seamless integra...
MANSCI
2010
14 years 10 months ago
2010
Firms that rely on functioning mission-critical equipment for their businesses cannot a¤ord signi…cant operational downtime due to system disruptions. To minimize the impact of...
IPPS
2007
IEEE
15 years 6 months ago
2007
IEEE
Fast hardware turnover in supercomputing centers, stimulated by rapid technological progress, results in high heterogeneity among HPC platforms, and necessitates that applications...