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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
14 years 9 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
DAC
2004
ACM
16 years 24 days ago
ORACLE: optimization with recourse of analog circuits including layout extraction
Long design cycles due to the inability to predict silicon realities is a well-known problem that plagues analog/RF integrated circuit product development. As this problem worsens...
Yang Xu, Lawrence T. Pileggi, Stephen P. Boyd
SLIP
2003
ACM
15 years 5 months ago
Error-correction and crosstalk avoidance in DSM busses
Aggressive process scaling and increasing clock rates have made crosstalk noise an important issue in VLSI design. Switching on adjacent wires on long bus lines can increase delay...
Ketan N. Patel, Igor L. Markov
DAC
2009
ACM
16 years 25 days ago
Nanoscale digital computation through percolation
In this study, we apply a novel synthesis technique for implementing robust digital computation in nanoscale lattices with random interconnects: percolation theory on random graph...
Mustafa Altun, Marc D. Riedel, Claudia Neuhauser
DAC
2010
ACM
15 years 3 months ago
Quality metric evaluation of a physical unclonable function derived from an IC's power distribution system
The level of security provided by digital rights management functions and cryptographic protocols depend heavily on the security of an embedded secret key. The current practice of...
Ryan Helinski, Dhruva Acharyya, Jim Plusquellic