In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
Long design cycles due to the inability to predict silicon realities is a well-known problem that plagues analog/RF integrated circuit product development. As this problem worsens...
Aggressive process scaling and increasing clock rates have made crosstalk noise an important issue in VLSI design. Switching on adjacent wires on long bus lines can increase delay...
In this study, we apply a novel synthesis technique for implementing robust digital computation in nanoscale lattices with random interconnects: percolation theory on random graph...
The level of security provided by digital rights management functions and cryptographic protocols depend heavily on the security of an embedded secret key. The current practice of...