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» Design and CAD for 3D integrated circuits
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MICRO
2009
IEEE
160views Hardware» more  MICRO 2009»
15 years 4 months ago
Variation-tolerant non-uniform 3D cache management in die stacked multicore processor
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...
Bo Zhao, Yu Du, Youtao Zhang, Jun Yang 0002
ISPD
2012
ACM
283views Hardware» more  ISPD 2012»
13 years 5 months ago
Low-power gated bus synthesis for 3d ic via rectilinear shortest-path steiner graph
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
Chung-Kuan Cheng, Peng Du, Andrew B. Kahng, Shih-H...
DATE
2008
IEEE
129views Hardware» more  DATE 2008»
15 years 4 months ago
Memory Technology for Extended Large-Scale Integration in Future Electronics Applications
Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
Dinesh Pamunuwa
MSE
2003
IEEE
89views Hardware» more  MSE 2003»
15 years 3 months ago
An Analog Integrated Circuit Design Laboratory
We present the structure of an analog integrated circuit design laboratory to instruct at both, senior undergraduate and entry graduate levels. The teaching material includes: a l...
Antonio F. Mondragón-Torres, Terry Mayhugh ...
DAC
1996
ACM
15 years 1 months ago
Experience in Designing a Large-scale Multiprocessor using Field-Programmable Devices and Advanced CAD Tools
This paper provides a case study that shows how a demanding application stresses the capabilities of today's CAD tools, especially in the integration of products from multipl...
Stephen Dean Brown, Naraig Manjikian, Zvonko G. Vr...