150 search results - page 8 / 30 » Design and CAD for 3D integrated circuits |
VLSID
2010
IEEE
14 years 8 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
SLIP
2009
ACM
15 years 4 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
DAC
2010
ACM
15 years 1 months ago
2010
ACM
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
We propose a layout-driven test-architecture design and optimization technique for core-based system-on-chips (SoCs) that are fabricated using three-dimensional (3D) integration. ...
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ISPD
2011
ACM
14 years 21 days ago
2011
ACM
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...