281 search results - page 28 / 57 » Design pattern density defined |
102
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DAC
2008
ACM
15 years 12 months ago
2008
ACM
Recently, processor power density has been increasing at an alarming rate resulting in high on-chip temperature. Higher temperature increases current leakage and causes poor relia...
ICCAD
2006
IEEE
15 years 7 months ago
2006
IEEE
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
LCN
2006
IEEE
15 years 5 months ago
2006
IEEE
Multi-hop relaying is an important concept in future generation wireless networks. It can address the inherent problems of limited capacity and coverage in cellular networks. Howe...
108
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ISPD
1998
ACM
15 years 3 months ago
1998
ACM
As chip size and design density increase, coupling effects (crosstalk) between signal wires become increasingly critical to on–chip timing and even functionality. A method is pr...
APSEC
2004
IEEE
15 years 2 months ago
2004
IEEE
Approaches to enforcing communication integrity in the implementation, exemplified by ArchJava, consider only architectural constraints, without taking into account the late integ...