Multi-break rearrangements break a genome into multiple fragments and further glue them together in a new order. While 2-break rearrangements represent standard reversals, fusions...
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
This paper describes an agile development methodology which combines agile principles with organizational patterns and adapts them to build embedded real-time systems focusing on ...
Lucas Cordeiro, Raimundo S. Barreto, Rafael Barcel...
This paper describes an ontology for enterprise modelling, The ontology has enabled conceptual integration of two different modelling methodologies, one based on UEML (Unified Ente...
Soft error reliability has become a first-order design criterion for modern microprocessors. Architectural Vulnerability Factor (AVF) modeling is often used to capture the probab...
Arun A. Nair, Stijn Eyerman, Lieven Eeckhout, Lizy...