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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
15 years 3 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
ISER
2004
Springer
148views Robotics» more  ISER 2004»
15 years 3 months ago
The Berkeley Lower Extremity Exoskeleton Project
In October 2003, the first functional load-bearing and energetically autonomous exoskeleton, called the Berkeley Lower Extremity Exoskeleton (BLEEX) was demonstrated, walking at th...
H. Kazerooni
CORR
2010
Springer
147views Education» more  CORR 2010»
14 years 6 months ago
RAFDA: A Policy-Aware Middleware Supporting the Flexible Separation of Application Logic from Distribution
Middleware technologies often limit the way in which object classes may be used in distributed applications due to the fixed distribution policies that they impose. These policies...
Scott M. Walker, Alan Dearle, Stuart J. Norcross, ...
BIOADIT
2004
Springer
15 years 3 months ago
The Genealogy of Biomimetics: Half a Century?s Quest for Dynamic IT
Abstract. Biologically inspired approaches to the design of general IT are presently flourishing. Investigating the scientific and historical roots of the tendency will serve to pr...
Mikkel Holm Sørensen
CODES
2004
IEEE
15 years 1 months ago
Fast exploration of bus-based on-chip communication architectures
As a result of improvements in process technology, more and more components are being integrated into a single System-on-Chip (SoC) design. Communication between these components ...
Sudeep Pasricha, Nikil D. Dutt, Mohamed Ben-Romdha...