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110
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ICCAD
2010
IEEE
14 years 11 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
CDC
2008
IEEE
15 years 8 months ago
2008
IEEE
— This paper builds on previous work on optimal methodologies for the design of numerical subsystems for non-linear, uncertain hardware-in-the-loop (HWIL) simulators. Firstly, th...
ICRA
2007
IEEE
15 years 8 months ago
2007
IEEE
—This paper describes the design, construction, and testing of a biomimetic pectoral (side) fin with actively controlled curvature for UUV propulsion. First, a 3D unsteady comput...
114
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AE
2007
Springer
15 years 8 months ago
2007
Springer
Abstract. We follow up on the work of Ebner[1] in studying representations for evolutionary design of objects. We adopt both the method and the simulation framework, and perform mo...
133
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QSIC
2009
IEEE
15 years 8 months ago
2009
IEEE
The presence of code and design smells can have a severe impact on the quality of a program. Consequently, their detection and correction have drawn the attention of both research...