The existing telecommunications infrastructure in most of the world is adequate to deliver voice and text applications, but demand for broadband services such as streaming video an...
Yann d'Halluin, Peter A. Forsyth, Kenneth R. Vetza...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
We describe an ensemble learning approach that accurately learns from data that has been partitioned according to the arbitrary spatial requirements of a large-scale simulation whe...
Robert E. Banfield, Lawrence O. Hall, Kevin W. Bow...
This paper describes a decision tree model and 3dimensional representation of information retrieved from various weblogs in relation to argumentative logics. The weblogs are consi...
VLSI research, in its continuous push toward further miniaturisation, is seeking to break through the limitations of current circuit manufacture techniques by moving towards biomi...
James Smaldon, Natalio Krasnogor, Alexander Camero...